专利名称：Method of producing a high-density printed
wiring board for mounting
发明人：Tomohisa Motomura,Osamu
Shimada,Yoshitaka Fukuoka
申请号：US09/008494申请日：19980116公开号：US05915753A公开日：19990629
摘要：A method of producing a high-density wiring board for mounting comprises thesteps of providing an electroconductive metallic film on the main surface thereof with aphotosensitive resist layer, subjecting the photosensitive resist layer to selectiveexposure to light and development thereby forming holes for selectively exposing thesurface of the electroconductive metallic foil in the photosensitive resist layer, depositingan electroconductive metal by plating on the exposed surface of the electroconductivemetallic foil thereby forming electroconductive bumps thereon, peeling off the
remainder of the photosensitive resist layer, superposing an insulating polymer sheet onthe electroconductive bump forming surface, pressing the resultant superposed layersso that the electroconductive bumps to pierce the polymer sheet in the direction ofthickness thereof and allowing the leading end parts of the electroconductive bumps toemerge from the polymer sheet and give rise to connecting terminal parts, andselectively etching off the electroconductive metallic foil thereby forming a wiringpattern.
申请人：KABUSHIKI KAISHA TOSHIBA
代理机构：Finnegan, Henderson, Farabow, Garrett & Dunner, LP.
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