Solder bump structure and method of manufacturing

专利名称：Solder bump structure and method of

manufacturing same

发明人：Pei-Haw Tsao,Bill Kiang,Pao-Kang Niu,Liang-Chen Lin,I-Tai Liu

申请号：US11592220申请日：20061103公开号：US07659632B2公开日：20100209

专利附图：

摘要：Solder bump structures for semiconductor device packaging is provided. In oneembodiment, a semiconductor device comprises a substrate having a bond pad and a first

passivation layer formed thereabove, the first passivation layer having an opening thereinexposing a portion of the bond pad. A metal pad layer is formed on a portion of thebond pad, wherein the metal pad layer contacts the bond pad. A second passivation layeris formed above the metal pad layer, the second passivation layer having an openingtherein exposing a portion of the metal pad layer. A patterned and etched polyimidelayer is formed on a portion of the metal pad layer and a portion of the secondpassivation layer. A conductive layer is formed above a portion of the etched polyimidelayer and a portion of the metal pad layer, wherein the conductive layer contacts themetal pad layer. A conductive bump structure is connected to the conductive layer.

申请人：Pei-Haw Tsao,Bill Kiang,Pao-Kang Niu,Liang-Chen Lin,I-Tai Liu

地址：Taichung TW,Hsinchu TW,Hsinchu TW,Hsinchu TW,Taipei TW

国籍：TW,TW,TW,TW,TW

代理机构：Birch, Stewart, Kolasch & Birch, LLP

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