High-power electronics component and assembly comp

专利名称：High-power electronics component and

assembly comprising at least one such high-power electronics component

发明人：BAJAN, LIVIU,EL GHARIB, SAMIR,SCHULTE,

GERRIT

申请号：EP11182462.9申请日：20110923公开号：EP2574157A1公开日：20130327

专利附图：

摘要：The power electronic component has heat sink as cooling structure (2), power

semiconductor module (1) and circuit arrangement (3) for controlling powersemiconductor module. The cooling structure comprises parallel channels for

accommodating flowing coolant. Several adjacent channels form supply channels havingend regions connected by connecting channels, and return channels having start regionsconnected by connecting channels, while start regions of return channels are connectedwith end regions of supply channels. An independent claim is included for electricalarrangement having power electronic component.

申请人：AEG POWER SOLUTIONS B.V.

地址：Weerenweg 29 1161 AH Zwanenburg NL

国籍：NL

代理机构：Graefe, Jörg

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