专利名称：METHOD FOR ELECTRO COPPERPLATING
SUBSTRATES
发明人：HUPE, JUERGEN,KRONENBERG,
WALTER,BREITKREUZ, EUGEN,SCHMERGEL,ULRICH
申请号：EP99952102.4申请日：19990514公开号：EP1080252A1公开日：20010307
摘要：the object of the invention is: the procedure of copper anodes
bevon\ás\áraoldhatatlan substrates using acidic bath of copper ions, thep\ótl\ás\ával separately, which is typical ofthe proportion of copperionoknagyobb directly taking in b\ázisosr\éz carbonate carbonate and \\/ or inthe form of\ésk\ül\ön electrolytes without diaphragms and auxiliary tankoperating mode, the elektrolithozk\épest bypass work. in the separate tank isseparated, the liberated carbon dioxidg\ázt. oh
申请人：BLASBERG OBERFLAECHENTECHNIK GMBH
地址：Merscheider Busch 7 42699 Solingen DE
国籍：DE
代理机构：Werner, Hans-Karsten, Dr.Dipl.-Chem.
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