PD - 9.529B
IRCZ44
HEXFET® Power MOSFET
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Dynamic dv/dt RatingCurrent Sense
175°C Operating TemperatureFast SwitchingEase of Paralleling
Simple Drive Requirements
VDSS = 60VRDS(on) = 0.028Ω
ID = 50*A
Description
Third Generation HEXFETs from International Rectifier provide the designer withthe best combination of fast switching, ruggedized device, low on-resistance andcost-effectiveness.
The HEXSense device provides an accurate fraction of the drain current throughthe additional two leads to be used for control or protection of the device. Thesedevices exhibit similar electrical and thermal characteristics as their IRF-seriesequivalent part numbers. The provision of a kelvin source connection effectivelyeliminates problems of common source inductance when the HEXSence isused as a fast, high-current switch in non current-sensing applications.
TO-220 HexSense
Absolute Maximum Ratings
Parameter
ID @ TC = 25°CID @ TC = 100°CIDM
PD @TC = 25°CVGSEASdv/dtTJTSTG
Continuous Drain Current, VGS @ 10VContinuous Drain Current, VGS @ 10VPulsed Drain Current Power DissipationLinear Derating FactorGate-to-Source Voltage
Single Pulse Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 secondsMounting Torque, 6-32 or M3 screw
Max.
50*372101501.0±20304.5
-55 to + 175300 (1.6mm from case)10 lbf•in (1.1 N•m)
Units
AWW/°CVmJV/ns°C
Thermal Resistance
Parameter
RθJCRθCSRθJA
Junction-to-Case
Case-to-Sink, Flat, Greased SurfaceJunction-to-Ambient—
Min.
—
——
Typ.
—0.50—
Max.
1.0—62
Units
°C/W
C-13
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C-14
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C-15
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C-16
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C-17
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C-18
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