专利名称：Sensitized substrates for chemical
metallization
发明人：POLICHETTE; JOSEPH,LEECH; EDWARD
J.,NUZZI; FRANCIS J.
申请号：US38758673申请日：19730813公开号：US3925578A公开日：19751209
摘要：There are provided new articles of manufacture, suitable for the production ofmetallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass,ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt oriron salts or salt compositions, which on exposure to radiant energy, such as heat, light,etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base froman electroless metal deposition solution in contact with the metal nuclei.
申请人：PHOTOCIRCUITS DIVISION OF KOLLMORGEN CORPORATION
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