Apparatus and method for electroless deposition of

专利名称：Apparatus and method for electroless

deposition of materials on semiconductorsubstrates

发明人：Igor C. Ivanov,Jonathan Weiguo Zhang,Artur

Kolics

申请号：US11138531申请日：20050526公开号：US081287B2公开日：20120306

专利附图：

摘要：A method for electroless deposition from a deposition solution in a working

chamber, where the process can include heating the deposition solution to its boilingpoint and subsequently reducing the temperature of the deposition solution to aworking temperature range that is between approximately 1% and approximately 25%below the boiling point of said solution under a predetermined pressure; and the processalso can include heating the deposition solution while filling an enclosed area of thechamber such that the deposition solution reaches its boiling point immediately after theenclosed area is filled.

申请人：Igor C. Ivanov,Jonathan Weiguo Zhang,Artur Kolics

地址：Dublin CA US,San Jose CA US,San Jose CA US

国籍：US,US,US

代理机构：Daffer McDaniel, LLP

代理人：Kevin L. Daffer,Mollie E. Lettang

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