Method of polishing wafers, a backing pad used the

专利名称：Method of polishing wafers, a backing pad

used therein, and method of making thebacking pad

发明人：Yukio Nakazima,Itsuo Kuroyanagi申请号：US08/292248申请日：19940818公开号：US05573448A公开日：19961112

摘要：A template-type wafer polishing method in which a plurality of wafers arepolished while they are fitted in the corresponding number of circumferentially spacedengagement holes in a template blank, with the backsides of the respective wafers heldby a backing pad, wherein the backing pad has, in its one surface next to the templateblank, a plurality of annular grooves each extending along a corresponding one of theengagement grooves in the template blank for relieving a stress concentrated on theperipheral edge of each wafer. The polished wafer is free from deformation, such asdeclination caused at the peripheral edge thereof due to stress concentration and,hence, has an extremely high degree of flatness. The backing pad and a method ofmaking the same are also disclosed.

申请人：SHIN-ETSU HANDOTAI CO., LTD.

代理机构：Nikaido, Marmelstein, Murray & Oram LLP

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