专利名称：WAFER CHUCK WITH INTERLEAVED
HEATING AND COOLING ELEMENTS
发明人：COLE, Kenneth, M., Sr.,STONE, William,
M.,OLSEN, Douglas, S.
申请号：EP01950961.1申请日：20010706公开号：EP1356499A2公开日：20031029
摘要：A workpiece chuck used, for example, to support a semiconductor wafer duringprocessing, is described. In one aspect, the chuck includes a thermal plate assembly whichincludes both heating and cooling capability. The heating element (12) can be a resistiveheater in a coiled configuration disposed in a plane. The cooling can be performed via acooling fluid circulated through cooling tubes (14) which are also disposed in a coiledconfiguration in a plane. The heating element and cooling tubes are coiled in aninterleaved fashion to provide uniform heating and cooling while allowing them tosimultaneously occupy the same plane. In another aspect, the chuck of the inventionprovides for interchangeable top surface assemblies used to support the workpiecechuck. The thermal plate assembly includes mechanical mounting for the top surfaceassembly. The interchangeable nature of the top surface assemblies permits the user touse multiple top surfaces with a single thermal plate.
申请人：Temptronic Corporation
地址：4 Commercial Street Newton, MA 02067-1653 US
国籍：US
代理机构：Greenwood, John David
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