专利名称：Optic wafer with reliefs, wafer assembly
including same and methods of dicing waferassembly
发明人：Rickie C. Lake申请号：US11732691申请日：20070404
公开号：US20080246066A1公开日：20081009
专利附图：
摘要：An optic wafer for assembly with an imager wafer, the optic wafer comprising aplurality of reliefs in a surface thereof coincident with street locations separating
mutually adjacent optic element locations. A wafer assembly that includes the opticwafer and an imager wafer and methods of dicing a wafer assembly are also disclosed.
申请人：Rickie C. Lake
地址：Eagle ID US
国籍：US
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