JSTD020D中英文对照版

JSTD020D中英文对照版（2022年）

1J-STD-020DMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices非密封固态表面贴装元件湿度/回流焊敏感度分级1 __( 目的）The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that aresensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solderreflow attachment and/or repair operations.本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装，储存，作业以避免在回流和维修作业中被损伤.This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passingthe criteria in this test method is not sufficient by itself to provide assurance of long-term reliability本标准用于判定合格的SMT封装应使用何种等级/预处理水平.依据本测试方法且通过对应判定标准的元件并不能保证其长期可靠性1.1 Scope （范围）This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because ofabsorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plasticencapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be usedby SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by boardassembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes havebeen made to a previously qualified SMD package, this method may be used for reclassification according to 4.2.此分类程序适用于所有非密封固体表面贴装元件，此部分元件由于吸收湿气而在回流焊接中容易损伤. 本文件所提及

的术语“SMD”指的是塑封或本体为吸湿材料的元件.分类的目的是为了让元件制造商能告知元件使用者（PCBA组装）其产品的湿敏等级，确保元件使用者能恰当作业，如果对之前认证过的SMD封装没有重大更改，依据4.2此方法亦可用于元件的再次分类.This standard cannot address all of the possible ponent, board assembly and product design binations. However, the standarddoes provide a test method and criteria for monly used technologies. Where mon or specialized ponents or technologiesare necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition ofproduct acceptance.此标准不能涵盖所有与设计，组装相关联的元件.但是，此标准为通用技术提供了一个测试方法和标准. 如果使用特殊技术或特殊元件，则需客户以及相关的制造方定义一个双方同意的产品接受标准.SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version ofJ-STD-020, JESD22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be revision unless a change in classification level or ahigher peak classification temperature is desired. Annex B provides an overview of major changes from Revision C to Revision D of thisdocument.在使用之前版本J-STD-020，JESD22-A112（已作废），IPC-SM-786（已作废）标准中已分级的湿敏元件除非敏感等级变更或耐温峰值提高，否则无须重新分级.附件B提供了版本C升级到版本D的主要变更.Note: If the procedures in this document are used on packaged devices that are not included in this specification’s scope, the failurecriteria for such packages must be agreed upon by the device supplier and their end user备注：当封装元件未在本标准规格范围内，如需使用此文件中的流程判定，则不良标准需元件供应商和其客户同意.1.2 Background （背景）The vapor pressure of moisture inside a nonhermetic package increases greatly when the package is exposed to the high temperature ofsolder reflow. Under certain conditions, this pressure can cause internal delamination of the packaging

materials from the die and/orleadframe/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting,thin film cracking, or cratering beneath the bonds. In the most severe case, the stress can result in external package cracks. This is

monly referred to as the ‘‘popcorn’’ phenomenon because the internal stress causes the package to bulge and then crack with anaudible ‘‘pop.’’ SMDs are more susceptible to this problem than through-hole parts because they are exposed to higher temperaturesduring reflow soldering. The reason for this is that the soldering operation must occur on the same side of the board as the SMD device.For wave-soldered through-hole devices, the soldering operation occurs under the board that shields the devices from the hot solderthrough-hole devices, the soldering operation occurs under the board that shields the devices from the hot solder Throughhole devices thatare soldered using intrusive soldering or ‘‘pin in paste’’ processes may experience the same type of moisture-induced failures as SMTdevices.非密封元件封装在回流高温条件下，其内部水蒸气压力猛增.在某一件下，压力将导致封装从内部分层或者内裂，邦定受损。更为严重的情况下，压力将导致外部封装开裂.此称之为“爆米花”现象，即由于内部压力引起封装膨胀并且伴随“砰，砰”声而裂开. 相对于通孔元件，由于SMD元件需更高的温度回流，因此此种情况尤为敏感.其原因为，SMT元件在PCB同一面回流因而受热更多。而对于通孔元件，其通常在在PCB之上，因而避免直接高温。如使用印刷回流制程的通孔元件则可能与出现SMD元件一样失效.1.3 Terms and Definitions( 术语与定义 ）accelerated equivalent soak – A soak at a higher temperature for a shorter time (pared to the standard soak), to provide roughly thesame amount of moisture absorption. See also soak快速浸泡：相对标准浸泡而言，使用更高温度在更短时间内浸泡acoustic microscope – Equipment

that creates an image using ultrasound to view a specimen’s surface or subsurface features, includingdefects and damage. See J-STD-035 for more information.声学显微镜：使用超声波对元件表面和内部特征（包括不良和损伤）进行查看并产生图像的设备area array package – A package that has terminations arranged in a grid on the bottom of the package and contained within the packageoutline？classification temperature (Tc) – The maximum body temperature at which the ponent manufacturer guarantees the ponent MSLas noted on the caution and/or bar code label per J-STD-033依据J-STD-033元件制造商在警告标签物料标签上所标示的元件本体最高耐温.crack – A separation within a bulk material. See also Delamination开裂：元件内部分离damage response – All irreversible changes caused by exposure to a reflow soldering profile.损伤反应：由回流引起的所有不可逆的的改变.dead-bug (orientation) – The orientation of the package with the terminals facing up.元件封装术语：元件引脚朝上的封装（如下图1）. delamination – An interfacial separation between two materials intended to be bonded. See also crack分层：两种物料结合部位的分离，参考裂开downbond area – An area for a wire bond on the die paddle, whose dimensions equal those of a single bond pad on the die.floor life – The allowable time period after removal from a moisture barrier bag, dry storage or dry bake and before the solder reflowprocess.车间寿命：元件从从防潮袋，干燥箱，或烘烤后取出到回流之间允许的时间

3full body hot air rework – The process of heating a package by directing heated gas at the package body in order to melt only thatpackage’s solder connections.本体热风返工：使用热风直接给整个元件本体加热而使元件焊点融化的过程live-bug (orientation) – The orientation of the package when resting on its terminals封装术语：元件引脚朝下的的封装manufacturer’s exposure time (MET) –

The maximum cumulative time after bake that ponents may be exposed to ambientconditions prior to shipment to the end user.制造商暴露时间：元件烘烤后，在运送给终端使用者之前，元件暴露在周边环境中最大允许时间.moisture/reflow sensitivity classification – The characterization of a ponent’s susceptibility to damage due to absorbed moisturewhen subjected to reflow soldering.湿度/回流敏感分类：元件由于吸收湿气在回流条件下受损的敏感特性moisture sensitivity level (MSL) – A rating indicating a ponent’s susceptibility to damage due to absorbed moisture when subjectedto reflow soldering湿敏等级：对于元件吸湿在回流条件下受损敏感性的分级package thickness – The ponent thickness excluding external terminals (balls, bumps, lands, leads) and/or nonintegral heat sinks封装厚度：元件除去外部插座,引脚,焊盘，散热片等的厚度peak package body temperature (Tp) – The highest temperature that an individual package body reaches during MSL classification.元件本体最高温度：在MSL分类中所规定的元件本体最高能承受的温度.reclassification – The process of assigning a new moisture sensitivity level to a previously classified device.重新分类：对之前已分类的元件重新指定新的湿敏等级soak – The exposure of a ponent for a specified time at a specified temperature and humidity. See also accelerated equivalent soak.浸泡：在特定的温度和湿度下，元件在特定的时间内暴露.3 __US( 设备）

）3.1 Temperature Humidity Chambers Moisture chamber(s), capable of operating at 85 °C/85% RH, 85 °C/60%RH, 60 °C/60% RH, and 30 °C/60% RH. Within the chamber working area, temperature tolerance must be ± 2 °C and the RH tolerancemust be ± 3% RH.恒温恒湿箱：需满足85 °C/85% RH, 85 °C/60% RH, 60 °C/60% RH, and 30 °C/60% RH操作要求，且在箱内工作区域温度误差必须± 2 °C，湿度误差3% RH.3.2.1 Full Convection (Preferred) Full convection reflow system

capable of maintaining the reflow profiles required by this standard全对流3.2.2 Infrared Infrared (IR)/convection solder reflow equipment capable of maintaining the reflow profiles required by this standard. It isrequired that this equipment use IR to heat only the air and not directly impinge upon the SMD Packages/ devices under test.红外回流3.3 Ovens Bake oven capable of operating at 125 +5/-0 °C.烤箱（能满足125 +5/-0 °C）3.4 Microscopes （显微镜）3.4.1 Optical Microscope Optical Microscope (40X for external and 100X for cross-section exam, higher magnification might berequired for verification).光学显微镜：（40倍用于外部检查，100倍用于切片检查）验证中可能要求更高倍数显微镜.3.4.2 Acoustic Microscope Typically a scanning acoustic microscope with C-Mode and Through Transmission capability. It should becapable of measuring a minimum delamination of 5% of the area being evaluated声波扫描显微镜：具备C-Modec穿透功能，且能量测评估区域最小5%的分层的能力.3.5 Cross-Sectioning Microsectioning equipment as mended per IPC...