Method of integrating an electronic component into

专利名称：Method of integrating an electronic

component into a substrate cavity

发明人：JOODAKI, MOJTABA, DR.-ING.申请号：EP06002799.2申请日：20060211公开号：EP16981A3公开日：20061025

专利附图：

摘要：the present invention relates to a process for integration of an electroniccomponent (8) or the like, in a substrate (1) with the following procedures: forming adielectric isolationsschicht (2, 3),4) on the front of a substrate (1); a complete

zur\ück\ätzen an area of the substrate (1) from the back of the substrate (1) toform a cavity (6); forming a photoresistiven layer (7) with a uniform thickness on the backof the substrate (1); arranging a s electronic component (8) in the cavity (6) formedphotoresistive layer (7) for a anhaften of the electronic component (8) on the same;remove the formed photoresistiven layer (7), except in the area where the electroniccomponent (8) on the photoresistiven layer (7) of the cavity (6) firm; and forming afixierschicht (9) on the back of the substrates s (1) for the fixing of the electroniccomponent (8) in the cavity (6) of the substrate (1).

申请人：ATMEL GERMANY GMBH

地址：Theresienstrasse 2 74072 Heilbronn DE

国籍：DE

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