Metal plating method

专利名称：Metal plating method发明人：山本 陽二郎,高山 政広申请号：JP2018063607申请日：20180329公开号：JP2019173112A公开日：20191010

摘要：The object of the present invention is to provide a metal plating method forforming a metal plating layer excellent in adhesion to a resin molded body. Solution: amethod of applying metal plating to a resin molded body, wherein (a) a metal freeparticle, (b) an aminothiophophenol and \\/ or aminophenyl disulfide, and (c) a firstelectroless plating bath containing a (c) cysteine methyl ester is immersed in a resinmolded body and subjected to electroless plating A metal plating method including anelectroless plating process. No selection

申请人：グリーンケム株式会社,株式会社姫路鍍金工業所

地址：大阪府堺市西区鶴田町１９－１９,兵庫県姫路市北条北河原９７８番地

国籍：JP,JP

代理人：田中 順也,水谷 馨也,迫田 恭子

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