专利名称：Flip-chip bonding of semiconductor chips发明人：Thomas, Sunil申请号：EP99201355.7申请日：19990501公开号：EP0977253A3公开日：20010117
专利附图：
摘要：A semiconductor assembly and method of fabrication comprising an integratedcircuit chip (10), an electrically insulating substrate (14), a multitude of solder balls (17)for interconnecting both parts while spacing them apart by a gap (16), and a polymericencapsulant (18) filling the gap. The method of fabrication includes heating and cooling
cycles, based on stress modeling, such that all mechanical stress levels in the dielectriclayers of the circuit chip and in the solder balls are reduced to levels safe for operatingthe semiconductor assembly.
申请人：Texas Instruments Incorporated
地址：7839 Churchill Way, Mail Station 3999 Dallas, Texas 75251 US
国籍：US
代理机构：Holt, Michael
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