Microelectromechanical device packages with integr

专利名称：Microelectromechanical device packages

with integral heaters

发明人：Terry Tarn申请号：US11872825申请日：20071016公开号：US09056764B2公开日：20150616

专利附图：

摘要：A microelectromechanical device package with integral a heater and a methodfor packaging the microelectromechanical device are disclosed in this invention. Themicroelectromechanical device package comprises a first package substrate and second

substrate, between which a microelectromechanical device, such as a micromirror arraydevice is located. In order to bonding the first and second package substrates so as topackage the microelectromechanical device inside, a sealing medium layer is deposited,and heated by the heater so as to bond the first and second package substratestogether.

申请人：Terry Tarn

地址：San Diego CA US

国籍：US

代理人：Jacqueline J. Garner,Frank D. Cimino

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