专利名称：Method for preventing electrostatic
discharge in an integrated circuit
发明人：Ta-Lee Yu申请号：US09784145申请日：20010216
公开号：US20010010948A1公开日：20010802
摘要：An integrated circuit package includes a semiconductor chip, a plurality of wiredpins, and at least one non-wired pin. The size of the non-wired pin is minimized, or thenon-wired pin is eliminated, in order to increase the lead pin spacing. The increase in leadpin spacing prevents electrostatic discharge failure in an integrated circuit package dueto electrostatic stressing of the non-wired pin.
申请人：WINBOND ELECTRONICS CORPORATION
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容