Through-type twin capacitor

专利名称：Through-type twin capacitor

发明人：Sasaki, Setsuo,Koganebuchi, Mutsuo,Taguchi,

Teruo

申请号：EP87300385.9申请日：19870116公开号：EP0229733A3公开日：19890111

专利附图：

摘要：A through-type twin capacitor includes a ground conductor (57) comprising aplate (57c) with a raised portion (57a) having a through hole (57b). A ceramic body (51)has two spaced-apart electrodes (54, 55) deposited on one surface and a common

electrode (56) deposited on its opposite surface, the ceramic body and the electrodeshaving two through holes (52, 53). The ceramic body is mounted on the ground conductorso that the common electrode contacts the raised portion. Two metallic caps (63,64),each of which has a through hole, are mounted on the respective spaced-apartelectrodes. Two conductive rods (59, 60) are positioned through the holes of the caps,the common holes in the ceramic body and the hole in the raised portion. A first hollowcylindrical insulating cover (58) is located at one surface of the ground conductor and asecond hollow cylindrical insulating cover (65) is located at the opposite surface of theground conductor. Insulating fillers (66, 67) are individually injected into the first andsecond covers. A pair of insulating tubes (61, 62) cover the conductive rods so that thetubes extend beyond the free end of the first insulating cover, thereby increasing theability of the capacitor to withstand high voltages applied thereto.

申请人：TDK Corporation

地址：13-1, Nihonbashi 1-chome Chuo-ku, Tokyo-to 103 JP

国籍：JP

代理机构：Rackham, Stephen Neil

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