MOUNT BOARD AND ELECTRONIC DEVICE

专利名称：MOUNT BOARD AND ELECTRONIC DEVICE发明人：Shinji WATANABE,Nobuhiro MIKAMI,Junya

SATO,Kenichiro FUJII,Katsumi ABE,AtsumasaSAWADA

申请号：US14016707申请日：20130903

公开号：US20140003015A1公开日：20140102

专利附图：

摘要：An object of the present invention is to allow stress that may be applied to asemiconductor package to be suppressed, when the semiconductor package is mounted

on a curved board. In a mount board , a semiconductor package is mounted on a curvedboard including a curved surface on at least a portion thereof. The curved board includesa pedestal portion disposed on a region of the curved surface portion where the

semiconductor package is mounted and having an upper surface thereof formed flat, anda plurality of pad portions disposed on the flat surface of the pedestal portion . Thepedestal portion is formed of an insulating material. The semiconductor package ismounted on the pad portions

申请人：Shinji WATANABE,Nobuhiro MIKAMI,Junya SATO,Kenichiro FUJII,KatsumiABE,Atsumasa SAWADA

地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP

国籍：JP,JP,JP,JP,JP,JP

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