SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

专利名称：SENSOR DEVICE AND MANUFACTURING

METHOD THEREOF

发明人：Toshihiko TAKAHATA,Takashige

SAITO,Masahiro HONDA,ShinpeiTAGA,Haruhisa KOIKE

申请号：US127136申请日：20100303

公开号：US20100224945A1公开日：20100909

专利附图：

摘要：In manufacturing a sensor device, a sensor chip having a sensing portion on a

surface thereof is mounted on one surface of a substrate, and a resin having a volatileproperty is arranged on the surface of the sensor chip, thereby covering the surface ofthe sensor chip. Then, the sensor chip and the substrate are sealed by a sealing member.After that, the sealing member is cured, and the resin is heated to be vaporized so that avoid is formed between a covered portion in the surface of the sensor chip, which iscovered by the sealing member, and the sealing member.

申请人：Toshihiko TAKAHATA,Takashige SAITO,Masahiro HONDA,ShinpeiTAGA,Haruhisa KOIKE

地址：Nukata-gun JP,Ama-gun JP,Okazaki-city JP,Nishio-city JP,Takahama-city JP

国籍：JP,JP,JP,JP,JP

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