Methods of forming conductive lines

专利名称：Methods of forming conductive lines发明人：Scott A. Southwick,Alex J. Schrinsky,Terrence

B. McDaniel

申请号：US10925158申请日：20040823公开号：US071166B2公开日：20061010

专利附图：

摘要：This invention includes methods of forming conductive lines, and methods offorming conductive contacts adjacent conductive lines. In one implementation, a methodof forming a conductive line includes forming a conductive line within an elongated trench

within first insulative material over a semiconductive substrate. The conductive line islaterally spaced from opposing first insulative material sidewall surfaces of the trench.The conductive line includes a second conductive material received over a different firstconductive material. The second conductive material is recessed relative to an

elevationally outer surface of the first insulative material proximate the trench. A secondinsulative material different from the first insulative material is formed within the trenchover a top surface of the conductive line and within laterally opposing spaces receivedbetween the first insulative material and the conductive line. In one implementation, aconductive contact is formed adjacent to and insulated from the conductive line.

申请人：Scott A. Southwick,Alex J. Schrinsky,Terrence B. McDaniel

地址：Boise ID US,Boise ID US,Boise ID US

国籍：US,US,US

代理机构：Wells St. John P.S.

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