专利名称：HIGHLY THERMALLY CONDUCTIVE
ELECTRONIC CONNECTOR
发明人：MILLER, JAMES, D.,SAGAL, E.,
MIKHAIL,MCCULLOUGH, KEVIN, A.
申请号：US0123678申请日：20010728公开号：WO0213315A3公开日：20020502
摘要：The electronic connector (10) includes an improved heat dissipating housing forcooling heat generating devices located within the connector (10). The electronicconnector (10) of the present invention enables the cost-effective cooling of electronicdevices (22, 24) within the connector (10) while realizing superior thermal conductivity andimproved electromagnetic shielding. A method of forming an electronic connector (10)that includes the steps of first providing a heat generating electronic component (22, 24)capable of electronically coupling two data devices together having a first port (16a) anda second port (16b). This component (22, 24) is typically mounted or installed into acircuit board (20). An outer housing (12) of moldable thermally conductive polymermaterial (102, 202, 302, 402) is overmolded around the heat generating electroniccomponent (22, 24) leaving the first port (16a) and the second port (16b) of connector(10) exposed.
申请人：COOL OPTIONS, INC.
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