专利名称:ETCH VARIATION TOLERANT
OPTIMIZATION
发明人:Xiaofeng LIU申请号:US153140申请日:20161214
公开号:US20170139320A1公开日:20170518
专利附图:
摘要:Disclosed herein is a computer-implemented method to improve a lithographicprocess for imaging a portion of a design layout onto a substrate using a lithographicprojection apparatus and for transferring the imaged portion of the design layout to the
substrate by an etching process, which includes the following steps: determining a valueof at least one evaluation point of the lithographic process for each of a plurality ofvariations of the etching process; computing a multi-variable cost function of a pluralityof design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of deviation from the determined values of the at leastone evaluation point; and reconfiguring the characteristics of the lithographic process byadjusting the design variables until a termination condition is satisfied. This method mayreduce the need of repeated adjustment to the lithographic process when the etchingprocess varies.
申请人:ASML Netherlands B.V.
地址:Veldhoven NL
国籍:NL
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